MAX9613 datasheet(2/12 Pages) MAXIM

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2 ______________________________________________________________________________________

Low-Power, High-Efficiency,

Single/Dual, Rail-to-Rail I/O Op Amps

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

IN+, IN-, SHDN, VCC to GND..................................-0.3V to +6V

OUT to GND............................................. -0.3V to (VCC + 0.3V)

Short-Circuit (GND) Duration to Either Supply Rail................. 5s

Continuous Input Current (any pin)................................. Q20mA

Thermal Limits (Note 1) Multilayer PCB

Continuous Power Dissipation (TA = +70NC)

6-Pin SC70 (derate 3.1mW/NC above +70NC).............245mW

JA.......................................................................326.5NC/W

JC..........................................................................115NC/W

8-Pin SC70 (derate 3.1mW/NC above +70NC).............245mW

..........................................................................326NC/W

JC..........................................................................115NC/W

Operating Temperature Range........................ -40NC to +125NC

Storage Temperature Range............................ -65NC to +150NC

Junction Temperature .....................................................+150NC

Lead Temperature (soldering, 10s) ................................+300NC

Soldering Temperature (reflow) ......................................+260NC

ELECTRICAL CHARACTERISTICS

(VCC = VSHDN = 3.3V, VIN+ = VIN- = VCM = 0V, RL = 10kI to VCC/2, TA = -40NC to +125NC. Typical values are at TA = +25NC, unless

otherwise noted.) (Note 2)

ABSOLUTE MAXIMUM RATINGS

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

DC CHARACTERISTICS

Input Voltage Range

VIN+, VIN- Guaranteed by CMRR test

-0.1

VCC +

0.1

Input Offset Voltage

VOS

TA = +25NC

100

TA = -40NC to +125NC after power-up auto-

calibration

150

TA = -40NC to +125NC

750

Input Offset Voltage Drift

VOS - TC

V/NC

Input Bias Current (Note 3)

TA = +40°C to +25°C

1.55

TA = +70°C

TA = +85°C

135

TA = +125°C

1.55

Common-Mode Rejection Ratio

CMRR

VCM = -0.1V to VCC + 0.1V, TA = +25NC

100

VCM = -0.1V to VCC + 0.1V, TA = -40NC to

+125NC

Input Offset Current (Note 3)

IOS

TA = +40°C to +25°C

0.5

TA = +70°C

TA = +85°C

TA = +125°C

400

Open-Loop Gain

AOL

+0.4V P VOUT P VCC - 0.4V, RL = 10kI

120

Output Short-Circuit Current

(Note 4)

ISC

To VCC

275

To GND

Output Voltage Low

VOL

RL = 10kI

0.011

RL = 600I

0.1

RL = 32I

0.170

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