OPA140 datasheet(4/25 Pages) TI

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OPA140

OPA2140, OPA4140

SBOS498A – JULY 2010 – REVISED AUGUST 2010

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ELECTRICAL CHARACTERISTICS: VS = +4.5V to +36V; ±2.25V to ±18V (continued)

Boldface limits apply over the specified temperature range, TA = –40°C to +125°C.

At TA = +25°C, RL = 2kΩ connected to midsupply, VCM = VOUT = midsupply, unless otherwise noted.

OPA140, OPA2140, OPA4140

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNIT

OUTPUT

Voltage Output

RL = 10kΩ, AOL ≥ 108dB

(V–)+0.2

(V+)–0.2

RL = 2kΩ, AOL ≥ 108dB

(V–)+0.35

(V+)–0.35

Short-Circuit Current

ISC

Source

+36

Sink

–30

Capacitive Load Drive

CLOAD

See Figure 20 and Figure 21

Open-Loop Output Impedance

f = 1MHz, IO = 0 (See Figure 19)

POWER SUPPLY

Specified Voltage Range

±2.25

±18

Quiescent Current

IO = 0mA

1.8

2.0

(per amplifier)

Over Temperature

2.7

CHANNEL SEPARATION

Channel Separation

At dc

0.02

mV/V

At 100kHz

mV/V

TEMPERATURE RANGE

Specified Range

–40

+125

°C

Operating Range

–55

+150

°C

THERMAL INFORMATION

OPA140,

OPA140

OPA2140

THERMAL METRIC(1)

UNITS

D (SO)

DGK (MSOP)

DBV (SOT23)

qJA

Junction-to-ambient thermal resistance

160

180

210

qJC(top)

Junction-to-case(top) thermal resistance

200

qJB

Junction-to-board thermal resistance

130

110

°C/W

yJT

Junction-to-top characterization parameter

n/a

yJB

Junction-to-board characterization parameter

120

105

qJC(bottom)

Junction-to-case(bottom) thermal resistance

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

THERMAL INFORMATION

OPA4140

THERMAL METRIC(1)

D (SO)

PW (TSSOP)

UNITS

qJA

Junction-to-ambient thermal resistance

135

qJC(top)

Junction-to-case(top) thermal resistance

qJB

Junction-to-board thermal resistance

°C/W

yJT

Junction-to-top characterization parameter

n/a

yJB

Junction-to-board characterization parameter

qJC(bottom)

Junction-to-case(bottom) thermal resistance

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

Product Folder Link(s): OPA140 OPA2140 OPA4140

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