www.ti.com

FEATURES

See mechanical drawings for dimensions.

DNU – Do not use

NC – No internal connection

DBV PACKAGE

(TOP VIEW)

6

5

1

Y

V

CC

NC

2

GND

3

4

X1

X2

DRL PACKAGE

(TOP VIEW)

2

GND

Y

V

CC

6

5

1

NC

3

4

X1

X2

DCK PACKAGE

(TOP VIEW)

2

GND

3

4

X1

Y

V

CC

6

5

NC

X2

1

YEP OR YZP PACKAGE

(BOTTOM VIEW)

2

GND

Y

V

CC

1 5

5

DNU

X1

4

3

X2

DESCRIPTION/ORDERING INFORMATION

SN74LVC1GX04

CRYSTAL OSCILLATOR DRIVER

SCES581B – JULY 2004 – REVISED DECEMBER 2006

• Available in Texas Instruments NanoStar™

• ±24-mA Output Drive at 3.3 V

and NanoFree™ Packages

• I

• Supports 5-V V

Operation

• Inputs Accept Voltages to 5.5 V

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• One Unbuffered Inverter (SN74LVC1GU04)

and One Buffered Inverter (SN74LVC1G04)

• ESD Protection Exceeds JESD 22

• Suitable for Commonly Used Clock

–

2000-V Human-Body Model (A114-A)

Frequencies:

–

200-V Machine Model (A115-A)

–

15 kHz, 3.58 MHz, 4.43 MHz, 13 MHz,

–

1000-V Charged-Device Model (C101)

25 MHz, 26 MHz, 27 MHz, 28 MHz

• Max t

• Low Power Consumption, 10-µA Max I

CC

SN74LVC1GU04 (inverter with unbuffered output) and the SN74LVC1G04 (inverter) functions into a single

device. The LVC1GX04 is optimized for use in crystal oscillator applications.

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoStar™ – WCSP (DSBGA)

PREVIEW

0.23-mm Large Bump – YEP

Reel of 3000

NanoFree™ – WCSP (DSBGA)

PREVIEW

0.23-mm Large Bump – YZP (Pb-free)

Reel of 3000

SN74LVC1GX04DBVR

–40

°C to 85°C

SOT (SOT-23) – DBV

CX4_

Reel of 250

SN74LVC1GX04DBVT

Reel of 3000

SN74LVC1GX04DCKR

SOT (SC-70) – DCK

D2_

Reel of 250

SN74LVC1GX04DCKT

SOT (SOT-553) – DRL

Reel of 4000

SN74LVC1GX04DRLR

UC_

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.

YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

• = Pb-free).

(3)

Package preview

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoStar, NanoFree are trademarks of Texas Instruments.

UNLESS

OTHERWISE

NOTED

this

document

contains

Copyright © 2004–2006, Texas Instruments Incorporated

PRODUCTION DATA information current as of publication date.

Products conform to specifications per the terms of Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.