© Koninklijke Philips Electronics N.V. 2006

All rights are reserved. Reproduction in whole or in part is prohibited without the prior

written consent of the copyright owner. The information presented in this document does

not form part of any quotation or contract, is believed to be accurate and reliable and may

be changed without notice. No liability will be accepted by the publisher for any

consequence of its use. Publication thereof does not convey nor imply any license under

patent- or other industrial or intellectual property rights.

Date of release: 17 February 2006

Document number: 9397 750 12261

Published in The Netherlands

Philips Semiconductors

PCK942P

Low voltage 1 : 18 clock distribution chip

19. Contents

1

General description . . . . . . . . . . . . . . . . . . . . . . 1

2

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3

Ordering information . . . . . . . . . . . . . . . . . . . . . 2

4

Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

5

Pinning information . . . . . . . . . . . . . . . . . . . . . . 2

5.1

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5.2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

6

Functional description . . . . . . . . . . . . . . . . . . . 3

6.1

Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 3

7

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

8

Static characteristics. . . . . . . . . . . . . . . . . . . . . 4

9

Dynamic characteristics . . . . . . . . . . . . . . . . . . 5

10

Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6

11

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

11.1

Introduction to soldering surface mount

packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

11.2

Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . . 7

11.3

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . . 7

11.4

Manual soldering . . . . . . . . . . . . . . . . . . . . . . . 8

11.5

Package related soldering information . . . . . . . 8

12

Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

13

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9

14

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 10

15

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

16

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

17

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

18

Contact information . . . . . . . . . . . . . . . . . . . . 10