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PD85025C Datasheet(PDF) 8 Page - STMicroelectronics |
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PD85025C Datasheet(HTML) 8 Page - STMicroelectronics |
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8 / 10 page ![]() Package mechanical data PD85025C 8/10 5 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com Figure 12. Package dimensions Table 8. M243 (.230 x .360 2L N/HERM W/FLG) mechanical data Dim. mm. Inch Min Typ Max Min Typ Max A 5.21 5.72 0.205 0.225 B 5.46 6.48 0.215 0.255 C 5.59 6.10 0.220 0.240 D 14.27 0.562 E 20.07 20.57 0.790 0.810 F 8.89 9.40 0.350 0.370 G 0.10 0.15 0.004 0.006 H 3.18 4.45 0.125 0.175 I 1.83 2.24 0.072 0.088 J 1.27 1.78 0.050 0.070 Controlling dimension: Inches 1022142E |
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