MFEV710_SDS

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© NXP B.V. 2011. All rights reserved.

Product short data sheet

PUBLIC

Rev. 3 — 14 February 2011

202630

7 of 12

NXP Semiconductors

MFEV710

Pegoda EV710

8.

Limiting values

[1]

Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only

and functional operation of the device at these or any other conditions beyond those indicated under

“recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for

extended periods may affect device reliability.

9.

Abbreviations

Table 3.

Limiting values [1]

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to

VSS (ground = 0 V).

Symbol Parameter

Conditions

Min

Typ

Max

Unit

supply voltage

active reader

4.75

5.00

5.25

V

ambient temperature

-

−25

+25

+85

°C

supply current

active, RF on

-

170

-

mA

Table 4.

Abbreviations

Acronym

Description

AL

Application Layer

APDU

Application Protocol Data Unit

BAL

Bus Abstraction Layer

EEPROM

Electrically Erasable Programmable Read Only Memory

HAL

Hardware Abstraction Layer

IAP

In-Application Programming

ISP

Internet service provider

JTAG

Joint Test Action Group

PAL

Protocol Abstraction Layer

PCD

Proximity Coupling Device

PICC

Proximity Integrated Circuit Card