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MIC61300 Datasheet(PDF) 13 Page - Micrel Semiconductor

Part # MIC61300
Description  Low Input Voltage, Single-Supply High-Current LDO
PDF  22 Pages
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Manufacturer  MICREL [Micrel Semiconductor]
Direct Link  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

MIC61300 Datasheet(HTML) 13 Page - Micrel Semiconductor

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Micrel, Inc.
MIC61300
September 2010
13
M9999-092910-A
Adjustable Regulator Design
The MIC61300 adjustable version allows programming
the output voltage from 0.5V to 3.0V by placing a resistor
divider network (R1, R2) from VOUT to GND (see
Application Circuit). The high side of R1 should be
connected at the point-of-load for high-accuracy Kelvin
sensing. VOUT is determined by the following equation:
+
×
=
1
R2
R1
0.5
VOUT
Eq. 1
where VOUT is the desired output voltage.
The resistor (R2) value between the FB pin and GND is
selected to maintain a minimum 10mA load on the
output.
The resistor values are calculated from the previous
equation, resulting in the following:
⎟⎟
⎜⎜
×
=
1
0.5
V
R2
R1
OUT
Eq. 2
Table 1 is a list of resistor combinations to set the output
voltage. A 1% tolerance is recommended for both R1
and R2. For a unity gain, 0.5V output voltage, connect
the FB pin directly to the output.
VOUT
R1
R2
0.5V
49.9Ω
0.6V
10.0Ω
49.9Ω
0.7V
20.0Ω
49.9Ω
0.8V
30.1Ω
49.9Ω
0.9V
40.2Ω
49.9Ω
1.0
49.9Ω
49.9Ω
1.1V
60.4Ω
49.9Ω
1.2V
69.8Ω
49.9Ω
1.5V
100Ω
49.9Ω
1.8V
130Ω
49.9Ω
2.2V
169Ω
49.9Ω
Table 1. Resistor Selection for Specific VOUT
Thermal Design
Linear regulators are simple to use. The most
complicated design parameters to consider are thermal
characteristics. To help reduce the thermal resistance,
the ePad (underneath the IC) should be soldered to the
PCB ground and the placement of thermal vias either
underneath or near the ePad is highly recommended.
Thermal design requires the following application-
specific parameters:
• Maximum ambient temperature (TA)
• Output current (IOUT)
• Output voltage (VOUT)
• Input voltage (VIN)
• Ground current (IGND)
First, calculate the power dissipation of the regulator
from these numbers and the device parameters from this
datasheet:
PD = (VIN - VOUT) × IOUT + (VIN × IGND)
Eq. 3
where the ground current is approximated by using
numbers from the Electrical Characteristics or Typical
Characteristics
sections
For example, given an expected maximum ambient
temperature (TA) of 75°C with VIN = 1.2V, VOUT = 0.9V,
and IOUT = 1.5A, first calculate the expected PD using
Equation 1:
PD = (1.2V – 0.9V) × 1.5A + 1.2V × 0.015A
= 0.468W
Eq. 4
Next, determnine the junction temperature for the
expected power dissipation above using the thermal
resistance (θJA) of the 10-pin 3mm × 3mm MLF
® (YML)
adhering to the following criteria for the PCB design:
1oz. copper and 100mm
2 copper area for the
MIC61300.
TJ = (θJA × PD) + TA
= (60.7
°C/W × 0.468W) + 75°C
= 103.4
°C
Eq. 5



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