AD9286 datasheet(9/28 Pages) AD

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AD9286

Rev. 0 | Page 9 of 28

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Rating

Electrical

AVDD to AGND

−0.3 V to +2.0 V

DRVDD to DRGND

−0.3 V to +2.0 V

AGND to DRGND

−0.3 V to +0.3 V

AVDD to DRVDD

−2.0 V to +2.0 V

D0+/D0− through D7+/D7−

to DRGND

−0.3 V to DRVDD + 0.3 V

DCO+, DCO− to DRGND

−0.3 V to DRVDD + 0.3 V

CLK+, CLK− to AGND

−0.3 V to AVDD + 0.2 V

AUXCLK+, AUXCLK− to AGND

−0.3 V to AVDD + 0.2 V

VIN1±, VIN2± to AGND

−0.3 V to AVDD + 0.2 V

SDIO/PWDN to DRGND

−0.3 V to DRVDD + 0.3 V

CSB to AGND

−0.3 V to DRVDD + 0.3 V

SCLK to AGND

−0.3 V to DRVDD + 0.3 V

Environmental

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature

(Soldering, 10 sec)

300°C

Junction Temperature

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 7. Thermal Resistance

Package Type

θJA

θJC

Unit

48-Lead LFCSP (CP-48-12)

30.4

2.9

°C/W

ESD CAUTION

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