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33981 Datasheet(PDF) 14 Page - Freescale Semiconductor, Inc |
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33981 Datasheet(HTML) 14 Page - Freescale Semiconductor, Inc |
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14 / 37 page ![]() Analog Integrated Circuit Device Data 14 Freescale Semiconductor 33981 FUNCTIONAL DEVICE OPERATION PROTECTION AND DIAGNOSTIC FEATURES directly but rather its effects on the low side MOSFET. When VDLS > VOCLS, the GLS pin goes to 0V and the OCLS internal current source is disconnected and OCLS goes to 0V. The GLS pin and the OCLS pin are reset (and the fault is delatched) by a logic [0] at the INLS pin for at least tRST(DIAG). Figure 13 and Figure 14 illustrate the behavior in case of overload on Low Side Gate driver. When connected to an external resistor, the OCLS pin with its internal current source sets the VOCLS level. By changing the external resistance, the protection level can be adjusted depending on low side characteristics. A 33 k Ω resistor gives a VDS level of 3.3 V typical. This protection circuitry measures the voltage between the drain of the low side (DLS pin) and the 33981 ground (GND pin). For this reason it is key that the low side source, the 33981 ground, and the external resistance ground connection are connected together in order to prevent false error detection due to ground shifts. The maximum OCLS voltage being 4.0 V, a resistor bridge on DLS must be used to detect a higher voltage across the low side. CONFIGURATION The CONF pin manages the cross-conduction between the internal MOSFET and the external low side MOSFET. With the CONF pin at 0V, the two MOSFETs can be independently controlled. A load can be placed between the high side and the low side. With the CONF pin at 5.0 V, the two MOSFETs cannot be on at the same time. They are in half-bridge configuration as shown in the simplified application diagram on page 1. If INHS and INLS are at 5.0 V at the same time, INHS has priority and OUT will be at VPWR. If INHS changes from 5.0 V to 0 V with INLS at 5.0 V, GLS will go to high state as soon as the VGS of the internal MOSFET is lower than 2.0 V typically. A half-bridge application could consist in sending PWM signal to the INHS pin and 5.0 V to the INLS pin with the CONF pin at 5.0 V. Figure 20, illustrates the simplified application diagram on page 1 with a DC motor and external low side. The CONF and INLS pins are at 5.0 V. When INHS is at 5.0 V, current is flowing in the motor. When INHS goes to 0 V, the load current recirculates in the external low side. BOOTSTRAP SUPPLY Bootstrap supply provides current to charge the bootstrap capacitor through the VPWR pin. A short time is required after the application of power to the device to charge the bootstrap capacitor. A typical value for this capacitor is 100 nF. An internal charge pump allows continuous MOSFET drive. When the device is in the sleep mode, this bootstrap supply is off to minimize current consumption. HIGH SIDE GATE DRIVER The high side gate driver switches the bootstrap capacitor voltage to the gate of the MOSFET. The driver circuit has a low-impedance drive to ensure that the MOSFET remains OFF in the presence of fast falling dV/dt transients on the OUT pin. This bootstrap capacitor connected between the power supply and the CBOOT pin provides the high pulse current to drive the device. The voltage across this capacitor is limited to about 13 V typical. An external capacitor connected between pins SR and GND is used to control the slew rate at the OUT pin. Figure 9 and Figure 10 give VOUT rise and fall time versus different SR capacitors. LOW SIDE GATE DRIVER The low side control circuitry is PWM capable. It can drive a standard MOSFET with an RDS(ON) as low as 10.0 mΩ at a frequency up to 60 kHz. The VGS is internally clamped at 12 V typically to protect the gate of the MOSFET. The GLS pin is protected against short by a local over temperature sensor. THERMAL FEEDBACK The 33981 has an analog feedback output (TEMP pin) that provides a value in inverse proportion to the temperature of the GND flag (pin 13). The controlling microcontroller can “read” the temperature proportional voltage with its analog- to-digital converter (ADC). This can be used to provide real- time monitoring of the PC board temperature to optimize the motor speed and to protect the whole electronic system. TEMP pin value is VTFEED with a negative temperature coefficient of DTFEED. REVERSE BATTERY The 33981 survives the application of reverse battery voltage as low as -16 V. Under these conditions, the output’s gate is enhanced to decrease device power dissipation. No additional passive components are required. The 33981 survives these conditions until the maximum junction rating is reached. In the case of reverse battery in a half-bridge application, a direct current passes through the external freewheeling diode and the internal high side. As Figure 11 shows, it is essential to protect this power line. The proposed solution is an external N-channel low side with its gate tied to battery voltage through a resistor. A high side in the VPWR line could be another solution. |
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