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Mechanical Drawing

Bias Arrangement

Bypass Capacitors - See App Note [2]

(Note: Engineering designator is M393)

Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.

Thickness: 0.076 +/- 0.010 (0.003 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold

All DC Bond Pads are 0.080 x 0.080 (0.003 x 0.003). All RF Bond Pads are 0.180 x 0.080 (0.007 x 0.003).

Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.

Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.172 mg

Bond Pad #1 (RF In)

Bond Pad #2 (Vd)

Bond Pad #3 (RF Out)

Bond Pad #4 (Rs-8.5 )

Bond Pad #5 (Rs-12 )

Bond Pad #6 (Rs-13 )

CMM4000-BD

2.0-18.0 GHz GaAs MMIC

Buffer Amplifier

3

1

4

1.000

(0.039)

0.348

(0.014)

2

0.0

0.0

1.890

(0.074)

1.795

(0.071)

5

1.675

(0.066)

6

1.555

(0.061)

1.414

(0.056)

0.539

(0.021)

3

1

4

2

5

6

Vd

RF In

RF Out

Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Characteristic Data and Specifications are subject to change without notice.

©2009 Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

September 2009 - Rev 21-Sep-09