MAX16929BGUI datasheet(2/25 Pages) MAXIM

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MAX16929

Automotive TFT-LCD Power Supply with Boost

Converter and Gate Voltage Regulators

INB, ENB to GND ..................................................-0.3V to +42V

BST to GND...........................................................-0.3V to +47V

BST to LXB ..............................................................-0.3V to +6V

LXB to GND..............................................................-6V to +42V

AVL, PGOOD to GND .............................................-0.3V to +6V

FBB, ENB to GND .................................................-0.5V to +12V

CP, GH to GND .....................................................-0.3V to +31V

CP, GH to GND (VINA = 3.3V) ..............................-0.3V to +29V

LXP to GND...........................................................-0.3V to +20V

DRVN to GND........................................................-25V to +0.3V

INA, COMPV, FBP to GND......................................-0.3V to +6V

ENP, DR, FB, GATE, COMPI, FBGH,

FBGL, REF, SEQ to GND .....................-0.3V to (VINA + 0.3V)

GND to PGNDP....................................................-0.3V to +0.3V

Continuous Power Dissipation (TA = +70NC)

TSSOP (derate 27mW/NC above +70NC)...................2162mW

Operating Temperature Range........................ -40NC to +105NC

Junction Temperature Range........................... -40NC to +150NC

Storage Temperature Range............................ -65NC to +150NC

Lead Temperature (soldering, 10s) ................................+300NC

Soldering Temperature (reflow) ......................................+260NC

TSSOP

Junction-to-Ambient Thermal Resistance (BJA) ..........37NC/W

Junction-to-Case Thermal Resistance (BJC) .................2NC/W

ABSOLUTE MAXIMUM RATINGS

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-

tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

PACKAGE THERMAL CHARACTERISTICS (Note 1)

ELECTRICAL CHARACTERISTICS

(VINB = 12V, VINA = 5V, VGND = VPGNDP = 0V, TA = TJ = -40NC to +105NC, typical values are at TA = +25NC, unless otherwise noted.)

(Note 2)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

BUCK CONVERTER

Supply Voltage Range

VINB

VOUTB = 5V (Note 3)

5.5

VOUTB = 3.3V (Note 3)

t < 500ms

Supply Current

IINB

VENB = 0V

VENB = VINB, no load, TA = +25NC

Undervoltage Lockout

VINB,UVLO AVL rising

3.1

3.5

Undervoltage Lockout Hysteresis

0.5

PWM Switching Frequency

fSWB

1.9

2.1

2.3

MHz

Spread-Spectrum Range

SSR

Output-Voltage Accuracy

VOUTB

6V P VINB P 18V,

ILOAD < full load

5V, continuous mode

-3%

+3%

5V, skip mode

-3%

+6%

3.3V, continuous mode

-3%

3.3

+3%

3.3V, skip mode

-3%

3.3

+6%

High-Side DMOS RDS_ON

RDS_ON(LXB) ILXB = 1A

180

400

Skip-Current Threshold

ISKIP

%IMAX

Current-Limit Threshold

IMAX

IOUTB = 1.2A option

1.6

2.4

IOUTB = 2.0A option

2.7

3.4

4.08

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