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MAX16929

Automotive TFT-LCD Power Supply with Boost

Converter and Gate Voltage Regulators

Total Power Dissipation

The total power dissipated in the package is the sum of

the losses previously calculated. Therefore, total power

dissipation can be estimated as follows:

Achieve maximum heat transfer by connecting the exposed

pad to a thermal landing pad and connecting the thermal

landing pad to a large ground plane through thermal vias.

Layout Considerations

Careful PCB layout is critical in achieving stable and

optimized performance. Follow the following guidelines

for good PCB layout:

1) Place decoupling capacitors as close as possible to

the device. Connect the power ground planes and the

analog ground plane together at one point close to the

device.

2) Connect input and output capacitors to the power

ground planes; connect all other capacitors to the

analog ground plane.

3) Keep the high-current paths as short and wide as

possible. Keep the path of switching currents short.

4) Place the feedback resistors as close to the IC as

possible. Connect the negative end of the resistive

divider and the compensation network to the analog

ground plane.

5) Route the high-speed switching node LXB and LXP

away from sensitive analog nodes (FB, FBP, FBGH,

FBGL, FBB, and REF).

Refer to the MAX16929 Evaluation Kit data sheet for a

recommended PCB layout.

Ordering Information/Selector Guide

Note: All devices are specified over the -40°C to +105°C operating temperature range.

/V denotes an automotive qualified part.

+Denotes a lead(Pb)-free/RoHS-compliant package.

*EP = Exposed pad.

Chip Information

PROCESS: BiCMOS

Package Information

For the latest package outline information and land patterns

“+”, “#”, or “-” in the package code indicates RoHS status only.

Package drawings may show a different suffix character, but

the drawing pertains to the package regardless of RoHS status.

PART

REGULATOR

BUCK

BUCK

BOOST

PIN-PACKAGE

MAX16929AGUI/V+

3.3

5

2

1.5

28 TSSOP-EP*

MAX16929BGUI/V+

1.8

5

2

1.5

28 TSSOP-EP*

MAX16929CGUI/V+

1.8

3.3

2

1.5

28 TSSOP-EP*

MAX16929DGUI/V+

3.3

5

2

0.75

28 TSSOP-EP*

MAX16929EGUI/V+

3.3

5

1.2

0.75

28 TSSOP-EP*

MAX16929FGUI/V+

1.8

5

2

0.75

28 TSSOP-EP*

MAX16929GGUI/V+

1.8

5

1.2

0.75

28 TSSOP-EP*

MAX16929HGUI/V+

1.8

3.3

2

0.75

28 TSSOP-EP*

MAX16929IGUI/V+

1.8

3.3

1.2

0.75

28 TSSOP-EP*

PACKAGE

TYPE

PACKAGE

CODE

OUTLINE

NO.

LAND

PATTERN NO.

28 TSSOP-EP

U28ME+1

21-0108

90-0147