xlamp xm-l leds

Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks

of Cree, Inc.

8

Copyright © 2010-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-

marks of Cree, Inc.

8

reflow solderinG characteristics

In testing, Cree has found XLamp XM-L LeDs to be compatible with JeDeC J-STD-020C, using the parameters listed

below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the

manufacturer of solder paste used.

Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.

Profile Feature

lead-Based solder

lead-free solder

Average Ramp-Up Rate (Ts

3°C/second max.

3°C/second max.

Preheat: Temperature Min (Ts

100°C

150°C

Preheat: Temperature Max (Ts

150°C

200°C

Preheat: Time (ts

60-120 seconds

60-180 seconds

Time Maintained Above: Temperature (T

183°C

217°C

Time Maintained Above: Time (t

60-150 seconds

60-150 seconds

Peak/Classification Temperature (Tp)

215°C

260°C

Time Within 5°C of Actual Peak Temperature (tp)

10-30 seconds

20-40 seconds

Ramp-Down Rate

6°C/second max.

6°C/second max

Time 25°C to Peak Temperature

6 minutes max.

8 minutes max.

Note: All temperatures refer to the topside of the package, measured on the package body surface.