LPC2378 datasheet(39/68 Pages) NXP

Part #	LPC2378

Description	Single-chip 16-bit/32-bit microcontrollers; 512 kB flash withISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC

PDF	68 Pages

Scroll/Zoom	100%

Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

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39 / 68 page

LPC2377_78

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Product data sheet

Rev. 5 — 17 June 2010

39 of 68

NXP Semiconductors

LPC2377/78

Single-chip 16-bit/32-bit microcontrollers

Thermal characteristics

The average chip junction temperature, Tj (°C), can be calculated using the following

equation:

(1)

• Tamb = ambient temperature (°C),

• Rth(j-a) = the package junction-to-ambient thermal resistance (°C/W)

• PD = sum of internal and I/O power dissipation

The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of

the I/O pins is often small and many times can be negligible. However it can be significant

in some applications.

amb

th j

–

()

Table 5.

Thermal characteristics

VDD = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C unless otherwise specified;

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Tj(max)

maximum junction

temperature

--125

°C

LPC2378 Datasheet(PDF) 39 Page - NXP Semiconductors