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9FG430 Datasheet(PDF) 5 Page - Integrated Device Technology

Part # 9FG430
Description  Four Output Differential Frequency Generator for PCIe Gen3 and QPI
PDF  18 Pages
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Manufacturer  IDT [Integrated Device Technology]
Direct Link  http://www.idt.com
Logo IDT - Integrated Device Technology

9FG430 Datasheet(HTML) 5 Page - Integrated Device Technology

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IDT® Four Output Differential Frequency Generator for PCIe Gen3 and QPI
1681C—08/26/10
9FG430
Four Output Differential Frequency Generator for PCIe Gen3 and QPI
5
Electrical Characteristics - Current Consumption
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS NOTES
IDD3.3
VDD, All outputs active @100MHz
80
95
mA
1
IDDA3.3OP
VDDA, All outputs active @100MHz
25
30
mA
1
IDD3.3
VDD, All outputs active @400MHz
100
120
mA
1
IDDA3.3OP
VDDA, All outputs active @400MHz
25
30
mA
1
IDD3.3PD
VDD, All differential pairs driven
75
90
mA
1
IDDA3.3PD
VDDA, All differential pairs driven
25
30
mA
1
IDD3.3PDZ
VDD, All differential pairs tri-stated
25
30
mA
1
IDDA3.3PDZ
VDDA, All differential pairs tri-stated
25
30
mA
1
1Guaranteed by design and characterization, not 100% tested in production.
2 I
REF = VDD/(3xRR). For RR = 475
(1%), IREF = 2.32mA. IOH = 6 x IREF and VOH = 0.7V @ ZO=50 .
TA = TCOM or TIND; Supply Voltage VDD = 3.3 V +/-5%, See Test Loads for loading
Operating Supply Current
Powerdown Current
Electrical Characteristics - Output Duty Cycle, Jitter, and Skew Characterisitics
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS NOTES
Duty Cycle
tDC
Measured differentially, PLL Mode
45
55
%
1
Skew, Output to Output
tsk3
VT = 50%
50
ps
1
Jitter, Cycle to cycle
tjcyc-cyc
25M input
50
ps
1,3
Jitter, Cycle to cycle
tjcyc-cyc
14.318M input
60
ps
1,3
1Guaranteed by design and characterization, not 100% tested in production.
2 I
REF = VDD/(3xRR). For RR = 475
(1%), IREF = 2.32mA. IOH = 6 x IREF and VOH = 0.7V @ ZO=50 .
3 Measured from differential waveform
4 Duty cycle distortion is the difference in duty cycle between the output and the input clock when the device is operated in bypass mode.
TA = TCOM or TIND; Supply Voltage VDD = 3.3 V +/-5%, See Test Loads for loading
Electrical Characteristics - DIF 0.7V Current Mode Differential Outputs
TA = TCOM or TIND; Supply Voltage VDD = 3.3 V +/-5%; See Test Loads s for loading conditions.
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX UNITS NOTES
Slew rate
Trf
Scope averaging on
1
4
V/ns
1, 2, 3
Slew rate matching
∆Trf
Slew rate matching, Scope averaging on
20
%
1, 2, 4
Voltage High
VHigh
660
850
1
Voltage Low
VLow
-150
150
1
Max Voltage
Vmax
1150
1
Min Voltage
Vmin
-300
1
Vswing
Vswing
Scope averaging off
300
mV
1, 2
Crossing Voltage (abs)
Vcross_abs
Scope averaging off
250
550
mV
1, 5
Crossing Voltage (var)
∆-Vcross
Scope averaging off
140
mV
1, 6
2 Measured from differential waveform
6 The total variation of all Vcross measurements in any particular system. Note that this is a subset of V_cross_min/max (V_cross
absolute) allowed. The intent is to limit Vcross induced modulation by setting V_cross_delta to be smaller than V_cross absolute.
mV
Statistical measurement on single-ended signal
using oscilloscope math function. (Scope
averaging on)
Measurement on single ended signal using
absolute value. (Scope averaging off)
mV
1Guaranteed by design and characterization, not 100% tested in production. IREF = VDD/(3xR
R). For RR = 475
(1%), IREF = 2.32mA.
IOH = 6 x IREF and VOH = 0.7V @ ZO=50 (100 differential impedance).
3 Slew rate is measured through the Vswing voltage range centered around differential 0V. This results in a +/-150mV window around
differential 0V.
4 Matching applies to rising edge rate of Clock / falling edge rate of Clock#. It is measured in a +/-75mV window centered on the
average cross point where Clock rising meets Clock# falling. The median cross point is used to calculate the voltage thresholds the
oscilloscope uses for the edge rate calculations.
5 Vcross is defined as voltage where Clock = Clock# measured on a component test board and only applies to the differential rising
edge (i.e. Clock rising and Clock# falling).



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