AD5116 datasheet(11/28 Pages) AD

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Data Sheet

AD5110/AD5112/AD5114

Rev. 0 | Page 11 of 28

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 6.

Parameter

Rating

VDD to GND

–0.3 V to +7.0 V

VLOGIC to GND

–0.3 V to +7.0 V

VA, VW, VB to GND

GND − 0.3 V to VDD + 0.3 V

IA, IW, IB

Pulsed1

Frequency > 10 kHz

RAW = 5 kΩ and 10 kΩ

±6 mA/d2

RAW = 80 kΩ

±1.5 mA/d2

Frequency ≤ 10 kHz

RAW = 5 kΩ and 10 kΩ

±6 mA/√d2

RAW = 80 kΩ

±1.5 mA/√d2

Continuous

RAW = 5 kΩ and 10 kΩ

±6 mA

RAW = 80 kΩ

±1.5 mA

Digital Inputs SDA and SCL

−0.3 V to +7 V or VLOGIC + 0.3 V

(whichever is less)

Operating Temperature Range3

−40°C to +125°C

Maximum Junction Temperature (TJ Max)

150°C

Storage Temperature Range

−65°C to +150°C

Reflow Soldering

Peak Temperature

260°C

Time at Peak Temperature

20 sec to 40 sec

Package Power Dissipation

(TJ max − TA)/θJA

Maximum terminal current is bounded by the maximum current handling of

the switches, maximum power dissipation of the package, and maximum

applied voltage across any two of the A, B, and W terminals at a given

resistance.

Pulse duty factor.

Includes programming of EEPROM memory.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is defined by JEDEC specification JESD-51, and the value is

dependent on the test board and test environment.

Table 7. Thermal Resistance

Package Type

θJA

θJC

Unit

8-Lead LFCSP

901

°C/W

JEDEC 2S2P test board, still air (0 m/sec air flow).

ESD CAUTION

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