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HT7718S Datasheet(PDF) 28 Page - Holtek Semiconductor Inc |
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HT7718S Datasheet(HTML) 28 Page - Holtek Semiconductor Inc |
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28 / 29 page ![]() Rev. 1.00 28 February 22, 2012 HT77xxS Carrier Tape Dimensions F1 F2 P2 P0 D0 W2 W0 W W1 P H0 H H1 t , h l1 TO92 Symbol Description Dimensions in mm I1 Taped Lead Length (2.5) P Component Pitch 12.7±1.0 P0 Perforation Pitch 12.7±0.3 P2 Component to Perforation (Length Direction) 6.35±0.40 F1 Lead Spread 2.5 +0.4/-0.0 F2 Lead Spread 2.5 +0.4/-0.0 Δh Component Alignment 0.0±0.1 W Carrier Tape Width 18.0 +1.0/-0.5 W0 Hold-down Tape Width 6.0±0.5 W1 Perforation Position 9.0±0.5 W2 Hold-down Tape Position (0.5) H0 Lead Clinch Height 16.0±0.5 H1 Component Height Less than 24.7 D0 Perforation Diameter 4.0±0.2 t Taped Lead Thickness 0.7±0.2 H Component Base Height 19.0±0.5 Note:Thicknesslessthan0.38±0.05mm~0.5mm. P0 Accumulated pitch tolerance: ±1mm/20pitches. ( ) Bracketed figures are for reference only. |
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