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ADSP-BF607 Datasheet(PDF) 42 Page - Analog Devices |
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ADSP-BF607 Datasheet(HTML) 42 Page - Analog Devices |
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42 / 44 page ![]() Rev. PrD | Page 42 of 44 | March 2012 ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609 Preliminary Technical Data OUTLINE DIMENSIONS Dimensions for the 19 mm × 19 mm CSP_BGA package in Figure 11 are shown in millimeters. SURFACE-MOUNT DESIGN Table 17 is provided as an aid to PCB design. For industry-stan- dard design recommendations, refer to IPC-7351, Generic Requirements for Surface-Mount Design and Land Pattern Standard. Figure 11. 349-Ball Chip Scale Package Ball Grid Array [CSP_BGA] (BC-349-1) Dimensions shown in millimeters COMPLIANT TO JEDEC STANDARDS MO-275-PPAB-2. 1.10 REF A B C D E F G H J K L M N P R T V W AA AB U Y 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 16 17 18 19 20 21 22 16.80 BSC SQ 0.50 0.45 0.40 19.10 19.00 SQ 18.90 COPLANARITY 0.20 BOTTOM VIEW DETAIL A TOP VIEW 1.50 1.36 1.21 0.35 NOM 0.30 MIN BALL DIAMETER SEATING PLANE A1 BALL CORNER A1 BALL CORNER DETAIL A 0.80 BSC 1.11 1.01 0.91 Table 17. BGA Data for Use with Surface-Mount Design Package Package Ball Attach Type Package Solder Mask Opening Package Ball Pad Size BC-349-1 Solder Mask Defined 0.4 mm Diameter 0.5 mm Diameter |
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