DRDC3105

2 of 9

www.diodes.com

December 2011

© Diodes Incorporated

A Product Line of

Diodes Incorporated

DRDC3105

Internal Device Schematic

Characteristic

Symbol

Limit

Unit

Supply Voltage

6.0

V

Input Voltage (Forward)

6.0

V

Input Voltage (Reverse)

-0.5

V

Output Sink Continuous Current

(Note 4)

500

mA

Repetitive Pulse Zener Energy Limit (Duty Cycle 0.01%)

50

mJ

Characteristic

Symbol

Value

Unit

Power Dissipation

Linear Derating Factor

(Note 4)

330

2.64

mW

mW/

°C

Thermal Resistance, Junction to Ambient

(Note 4)

379

°C/W

Thermal Resistance, Junction to Case

(Note 5)

306

°C/W

Operating and Storage Temperature Range

-55 to +150

°C

Notes:

4. For a device surface mounted on 25mm X 25mm X 1.6mm FR4 PCB with high coverage of single sided 1 oz copper, in still air condition; the device is

measured when operating in a steady-state condition.

5. Thermal resistance from junction to case.

Characteristic

Symbol

Value

Unit

Power Dissipation

Linear Derating Factor

(Note 6 & 9)

0.9

7.2

W

mW/

°C

(Note 6 & 10)

1.1

8.8

(Note 7 & 9)

1.7

13.6

Thermal Resistance, Junction to Ambient

(Note 6 & 9)

139

°C/W

(Note 6 & 10)

113

(Note 7 & 9)

73

Thermal Resistance, Junction to Leads

100

°C/W

Operating and Storage Temperature Range

-55 to +150

°C

Notes:

6. For a device surface mounted on 25mm X 25mm FR4 PCB with high coverage of single sided 1 oz copper, in still air conditions

7. For a device surface mounted on FR4 PCB measured at < 5sec

8. Repetitive rating – pulse width limited by maximum junction temperature. Refer to transient thermal impedance graph

9. For a device with one active die

10. For a device with two die running at equal power

11. Thermal resistance from junction to solder-point (at the end of the “OUT” lead).