SE1030W

LightCharger

Final

43-DST-01

§ Rev 1.5 § May 24/02

2 of 9

Bondpad Diagram

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VCC

VCC

VEE2

VEE1

VEE1

VEE1

TZ_IN

OUTN

OUTP

VCC

11

10

9

7

6

5

4

3

8

1

2

DNC

Bondpad Description

Pad No.

Name

Description

1

VCC

Positive supply (+3.3 V), pads 1, 8 & 11 are connected on chip. Only one pad needs

to be bonded.

2

DNC

Do not connect.

3

TZ_IN

Input pad (connect to photodetector anode).

4

VEE2

Negative supply (0V) – Note this is separate ground for the input stage, which is AC

coupled on chip. There is no DC current through this pad.

5

VEE1

Negative supply (0V), pads 5, 6 & 7 are connected on chip. Only one pad needs to be

bonded.

6

VEE1

Negative supply (0V), pads 5, 6 & 7 are connected on chip. Only one pad needs to be

bonded.

7

VEE1

Negative supply (0V), pads 5, 6 & 7 are connected on chip. Only one pad needs to be

bonded.

8

VCC

Positive supply (+3.3 V), pads 1, 8 & 11 are connected on chip. Only one pad needs

to be bonded.

9

OUTN

Negative differential voltage output.

10

OUTP

Positive differential voltage output.

11

VCC

Positive supply (+3.3 V), pads 1, 8 & 11 are connected on chip. Only one pad needs

to be bonded.