SE1030W

LightCharger

Final

43-DST-01

§ Rev 1.5 § May 24/02

7 of 9

The diagram below shows the bondpad configuration of the SE1030W Transimpedance Amplifier. Note that the

diagram is not to scale. All bondpads are 92 µm x 92 µm with a passivation opening of 82 µm x 82 µm. There are

three VCC and three VEE1 pads for ease of wire bonding; the VCC and VEE1 pads respectively are connected on-

chip and only one pad of each type is required to be bonded out.

Mechanical die visual inspection criteria per MIL-STD-883 Method 2010.10 Condition B Class Level B.

Top

View

Side View

123.0

1250.0

307.0

134.0

134.0

230.0

199.0

1004.0

All Dimensions in Microns (µm)

Top

View

Side View

123.0

1250.0

307.0

134.0

134.0

230.0

199.0

1004.0

All Dimensions in Microns (µm)