SE1030W

LightCharger

Final

43-DST-01

§ Rev 1.5 § May 24/02

8 of 9

Applications Information

Note that all VCC pads (1, 8, 11) are connected on-chip, as are the VEE1 pads (5, 6, 7), and only one pad of each

type is required to be bonded out. However, in order to minimize inductance for optimum high speed performance, it

is recommended that all power pads are wire bonded. The VEE2 pad is not connected on chip to VEE1 and must be

bonded out separately.

TZ Amplifier

SE1030W

TZ_IN

VCC

OUTP

OUTN

VEE1

VEE2

1

8

11

3

4

5

6

7

10

9

0 V

+3.3 V

PIN Bias

PIN

1 nF min

1 nF min

To 50 O loads,

AC coupled