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MPC5554 Microcontroller Data Sheet, Rev. 4

Revision History for the MPC5554 Data Sheet

Freescale Semiconductor

Revision History for the MPC5554 Data Sheet

The history of revisions made to this data sheet are described in this section.

5.1

Changes between Revision 3 and Revision 4

5.2

Changes between Revision 2 and Revision 3

The substantive changes incorporated in MPC5554 Data Sheet Rev. 2.0 to produce Rev. 3.0 are listed in

Table 28. The changes are listed in sequential page number order.

Location

Description of Changes

Section 3.7, “Power-Up/Down

Sequencing”

Added the following paragraph in Section 3.7, “Power-Up/Down Sequencing”:

“During initial power ramp-up, when Vstby is 0.6v or above. a typical current of 1-3mA and

maximum of 4mA may be seen until VDD is applied. This current will not reoccur until Vstby is

lowered below Vstby min. specification”.

Moved Figure 2 (fISTBY Worst-case Specifications) “ISTBY Worst-case Specifications” to

Section 3.7, “Power-Up/Down Sequencing”.

Section 3.8, “DC Electrical

Specifications”

Removed the footnote “Figure 3 shows an illustration of the IDD_STBY values interpolated for

these temperature values”.

Changed the footnote attached to IDD_STBY” to “The current specification relates to average

standby operation after SRAM has been loaded with data. For power up current see

Section 3.7, “Power-Up/Down Sequencing”,Figure 2 (fISTBY Worst-case Specifications).”

In Table 9 (DC Electrical Specifications (TA = TL to TH)) the Characteristic “Refer to Figure 3 for

an interpolation of this data” changed to “RAM standby current”.

Table 28. Changes Between Rev. 2.0 and 3.0

Location

Description of Changes

Throughout:

Changed ‘TA = TL – TH’ to ‘TA = TL to TH.’

Title page:

Changed the Revision number from 2 to 3. Changed the date. Made the same change in the lower left corner of the

back page.

Section 1, “Overview”

• Fourth paragraph, First sentence: Deleted ‘of the MPC5500 family’; Second to last sentence: Deleted ‘can’.

• Fifth paragraph, First sentence: Replaced ‘MPC5500 family’ with ‘MPC5554’; Last sentence: Replaced ‘can be’

with ‘is’.

• Sixth paragraph, First sentence: Replaced ‘MPC5500 family’ with ‘MPC5554’;

• Second to last paragraph: Rewrote to read: The MCU has an on-chip enhanced queued dual analog-to-digital

converter (eQADC). The 416 package has 40-channels.

Section 3.2.1, “General Notes for Specifications at Maximum Junction Temperature

Updated the address of Semiconductor Equipment and Materials International

3081 Zanker Rd.

San Jose, CA., 95134

(408) 943-6900

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