MAX5713 datasheet(2/27 Pages) MAXIM

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Ultra-Small, Quad-Channel, 8-/10-/12-Bit Buffered

Output DACs with Internal Reference and SPI Interface

MAX5713/MAX5714/MAX5715

VDD, VDDIO to GND ................................................ -0.3V to +6V

OUT_, REF to GND ................................. ....-0.3V to the lower of

(VDD + 0.3V) and +6V

CSB, SCLK, LDAC, CLR to GND ............................ -0.3V to +6V

DIN, RDY to GND........................................-0.3V to the lower of

(VDDIO + 0.3V) and +6V

Continuous Power Dissipation (TA = +70NC)

TSSOP (derate at 10mW/NC above 70NC)...................797mW

WLP (derate at 16.1mW/NC above 70NC)..................1288mW

Maximum Continuous Current into Any Pin .................... Q50mA

Operating Temperature Range........................ -40NC to +125NC

Storage Temperature Range............................ -65NC to +150NC

Lead Temperature (TSSOP only)(soldering, 10s)...........+300NC

Soldering Temperature (reflow) .................................... +260NC

TSSOP

Junction-to-Ambient Thermal Resistance (θJA) .......100NC/W

Junction-to-Case Thermal Resistance (θJC) ...............30NC/W

WLP

Junction-to-Ambient Thermal Resistance (θJA)

(Note 2)........................................................................62NC/W

ABSOLUTE MAXIMUM RATINGS

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

Note 2: Visit www.maxim-ic.com/app-notes/index.mvp/id/1891 for information about the thermal performance of WLP packaging.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-

tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

PACKAGE THERMAL CHARACTERISTICS (Note 1)

ELECTRICAL CHARACTERISTICS

(VDD = 2.7V to 5.5V, VDDIO = 1.8V to 5.5V, VGND = 0V, CL = 200pF, RL = 2kI, TA = -40NC to +125NC, unless otherwise noted. Typical

values are at TA = +25NC.) (Note 3)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

DC PERFORMANCE (Note 4)

Resolution and Monotonicity

MAX5713

Bits

MAX5714

MAX5715

Integral Nonlinearity (Note 5)

INL

MAX5713

-0.25

0.05

+0.25

LSB

MAX5714

-0.5

0.25

+0.5

MAX5715

-1

0. 5

Differential Nonlinearity (Note 5)

DNL

MAX5713

-0.25

0.05

+0.25

LSB

MAX5714

-0.5

0.1

+0.5

MAX5715

-1

0.2

Offset Error (Note 6)

-5

0.5

Offset Error Drift

V/NC

Gain Error (Note 6)

-1.0

0.1

+1.0

%FS

Gain Temperature Coefficient

With respect to VREF

3.0

ppm of

FS/NC

Zero-Scale Error

Full-Scale Error

With respect to VREF

-0.5

+0.5

%FS

MAX5713 Datasheet(PDF) 2 Page - Maxim Integrated Products

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