ISO1540 datasheet(9/21 Pages) TI1

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300

100

150

200

Case Temperature ( C)

200

350

100

250

150

VCC1 =

= 3.6 V

VCC2

VCC1 =

= 5.5 V

VCC2

ISO1540

ISO1541

www.ti.com

SLLSEB6 – JULY 2012

Table 4. IEC 60664-1 RATINGS TABLE

PARAMETER

TEST CONDITIONS

SPECIFICATION

Basic isolation group

Material group

Rated mains voltage

≤ 150 VRMS

I–IV

Installation classification

Rated mains voltage

≤ 300 VRMS

I–III

Rated mains voltage

≤ 400 VRMS

I–II

Table 5. REGULATORY INFORMATION

VDE

CSA

Certified according to DIN EN 60747-5-2

Approved under CSA Component Acceptance Notice

Recognized under UL 1577

(VDE 0884 Part 2) and EN 61010-1

#5A, CSA/IEC 60950-1 & CSA/IEC 61010-1

Component Recognition Program

Basic insulation per CSA 60950-1-07 and IEC 60950-1

(2nd Ed), 390 VRMS maximum working voltage

Basic Insulation

Basic insulation per CSA 61010-1-04 and IEC 61010-1

Maximum Transient Overvoltage, 4000 VPK

Single Protection Isolation Voltage,

(2nd Ed), 300 VRMS maximum working voltage

Maximum Surge Voltage, 4000 VPK

2500 VRMS

(1)

Reinforced insulation per CSA 61010-1-04 and IEC

Maximum Working Voltage, 566 VPK

61010-1 (2nd Ed), 150 VRMS maximum working

voltage

File number: 40016131 (pending)

File number: 220991 (pending)

File number: E181974

(1)

Production tested

≥ 3000 VRMS for 1 second in accordance with UL 1577.

IEC SAFETY LIMITING VALUES

Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry.

A failure of the IO can allow low resistance to ground or the supply and, without current limiting, dissipate

sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system

failures.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

θJA = 114.6°C/W, VI = 5.5V, TJ = 150°C, TA = 25°C

198

Safety input, output, or supply

D-8

current

θJA = 114.6°C/W, VI = 3.6V, TJ = 150°C, TA = 25°C

303

Maximum case temperature

150

°C

The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum

ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the

application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the

Thermal Information table is that of a device installed on a High-K Test Board for Leaded Surface Mount

Packages. The power is the recommended maximum input voltage times the current. The junction temperature is

then the ambient temperature plus the power times the junction-to-air thermal resistance.

ISO154x THERMAL DERATING

Figure 5.

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