MFRC63002R datasheet(107/118 Pages) NXP

107 / 118 page

MFRC630

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Product data sheet

COMPANY PUBLIC

Rev. 3.1 — 6 September 2012

227531

107 of 118

NXP Semiconductors

MFRC630

Contactless reader IC

Detailed package information can be found at

http://www.nxp.com/package/SOT617-1.html.

16. Handling information

Moisture Sensitivity Level (MSL) evaluation has been performed according to

SNW-FQ-225B rev.04/07/07 (JEDEC J-STD-020C). MSL for this package is level 2 which

means 260

C convection reflow temperature.

For MSL2:

• Dry pack is required.

• 1 year out-of-pack floor life at maximum ambient temperature 30 C/ 85 % RH.

For MSL1:

• No dry pack is required.

• No out-of-pack floor live spec. required.

17. Packing information

Fig 33. Packing information 1 tray

001aaj740

strap 46 mm from corner

tray

chamfer

PIN 1

chamfer

PIN 1

printed piano box

ESD warning preprinted

barcode label (permanent)

barcode label (peel-off)

QA seal

Hyatt patent preprinted

The straps around the package of

stacked trays inside the piano-box

have sufficient pre-tension to avoid

loosening of the trays.

In the traystack (2 trays)

only ONE tray type* allowed

*one supplier and one revision number.

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