4.3 Part Numbers and Packaging

Q KL## A FFF T PP CC (N)

Qualification status

Family

Flash size

Temperature range (°C)

Speed (MHz)

Package identifier

Tape and Reel (T&R)

Key attribute

Figure 4. Part numbers diagrams

Field

Description

Values

Q

Qualification status

• M = Fully qualified, general market flow

• P = Prequalification

KL##

Kinetis family

• KL24

• KL25

A

Key attribute

• Z = Cortex-M0+

FFF

Program flash memory size

• 32 = 32 KB

• 64 = 64 KB

• 128 = 128 KB

• 256 = 256 KB

R

Silicon revision

• (Blank) = Main

• A = Revision after main

T

Temperature range (°C)

• V = –40 to 105

PP

Package identifier

• FM = 32 QFN (5 mm x 5 mm)

• FT = 48 QFN (7 mm x 7 mm)

• LH = 64 LQFP (10 mm x 10 mm)

• LK = 80 LQFP (12 mm x 12 mm)

CC

Maximum CPU frequency (MHz)

• 4 = 48 MHz

N

Packaging type

• R = Tape and reel

• (Blank) = Trays

4.4 KL24/KL25 Family Features

The following sections list the differences among the various devices available within the KL24/KL25 family.

The features listed below each part number specify the maximum configuration available on that device. The signal

multiplexing configuration determines which modules can be used simultaneously.

The following tables are limited to 128 KB Flash and 80-pin packages, more high Flash density and large package devices

will be available soon. Keep tracking Freescale website to get the latest update.

Features

KL24/KL25 Product Brief, Rev. 2, 6/2012

8

Preliminary

Freescale Semiconductor, Inc.

General Business Information