RT2516 datasheet(8/9 Pages) RICHTEK

8 / 9 page

RT2516

DS2516-01

July 2012

www.richtek.com

is a registered trademark of Richtek Technology Corporation.

Figure 5. Derating Curve of Maximum Power Dissipation

For continuous operation, do not exceed absolute

maximum junction temperature. The maximum power

dissipation depends on the thermal resistance of the IC

package, PCB layout, rate of surrounding airflow, and

difference between junction and ambient temperature. The

maximum power dissipation can be calculated by the

following formula :

PD(MAX) = (TJ(MAX)

− TA) / θJA

where TJ(MAX) is the maximum junction temperature, TA is

the ambient temperature, and

θJAis the junction to ambient

thermal resistance.

For recommended operating condition specifications, the

maximum junction temperature is 125

°C. The junction to

ambient thermal resistance,

θJA, is layout dependent. For

SOP-8 (Exposed Pad) package, the thermal resistance,

θJA, is 49°C/W on a standard JEDEC 51-7 four-layer

thermal test board. The maximum power dissipation at TA

= 25

°C can be calculated by the following formula :

PD(MAX) = (125

°C − 25°C) / (49°C/W) = 2.04W for

SOP-8 (Exposed Pad) package

The maximum power dissipation depends on the operating

ambient temperature for fixed TJ(MAX) and thermal

resistance,

θJA. The derating curve in Figure 5 allows the

designer to see the effect of rising ambient temperature

on the maximum power dissipation.

Figure 4. Short Circuit Protection when Output Short

Circuit Occurs

VOUT Short to GND

VOUT

IOUT

IC Temperature

ILIM

ILIM＇

0.0

0.4

0.8

1.2

1.6

2.0

2.4

2.8

3.2

025

100

125

Ambient Temperature (°C)

Four-Layer PCB

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