RT9715CGF datasheet(4/15 Pages) RICHTEK

4 / 15 page

RT9715

DS9715-03 April 2011

www.richtek.com

Note 1.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.

These are stress ratings only, and functional operation of the device at these or any other conditions beyond those

indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

Note 2.

θJA is measured in the natural convection at TA = 25°C on a low effective single layer thermal conductivity test board of

JEDEC 51-3 thermal measurement standard.

Note 3.

Devices are ESD sensitive. Handling precaution is recommended.

Note 4.

The device is not guaranteed to function outside its operating conditions.

Parameter

Symbol

Test Conditions

Min

Typ

Max

Unit

Logic_High Voltage

VIH

VIN = 2.7V to 5.5V

EN/EN

Threshold

Logic_Low Voltage

VIL

VIN = 2.7V to 5.5V

0.8

EN/EN Input Current

IEN/EN

VEN = 5V

0.01

0.1

Output Leakage Current

ILEAKAGE

VEN = 0V, RLOAD = 0Ω

0.5

Output Turn-On Rise Time

TON_RISE

10% to 90% of VOUT Rising

200

FLG Output Resistance

RFLG

ISINK = 1mA

FLG Off Current

IFLG_OFF

VFLG = 5V

0.01

FLG Delay Time

From fault condition to FLG

assertion

Shutdown Auto-Discharge

Resistance

RDischarge

VEN = 0V, VEN = 5V

100

150

Under-Voltage Lockout

VUVLO

VIN Rising

1.3

1.7

Under-Voltage Hysteresis

ΔVUVLO

VIN Decreasing

0.1

VOUT > 1V

120

°C

Thermal Shutdown Protection

TSD

VOUT = 0V

100

°C

Thermal Shutdown Hysteresis

VOUT = 0V

°C

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