RT9505

10

DS9505-02 April 2011

www.richtek.com

The GND should be connected to a strong ground plane for heat sinking and noise protection.

noise coupling.

Output capacitor should be placed close to IC and connected to ground plane to reduce noise coupling.

The TS's capacitor should be placed close to TS (Pin 9) and connected to ground plane. The capacitance (0.1uF to

10uF) base on PCB layout. When PCB has poor layout, the 10uF is recommended to prevent noise.

9

8

7

1

2

3

4

5

10

GND

C2

C3

C1

ACIN

NC

GND

CHG_S

PGOOD

BATT

TS

ISETA

NC

EN

Battery

GND

The capacitor should be

placed close to IC pin and

connected to ground plane.

The GND should be connected to a

strong ground plane for heat sinking

and noise protection.

isolated from other noisy traces.

The short wire is recommended to

prevent EMI and noise coupling.

The TS's capacitor should be

placed close to TS(Pin 9) and

connected to ground plane.

The capacitance (0.1uF to

10uF) base on PCB layout.

When PCB has poor layout

the 10uF is recommended to

prevent noise.

Figure 4