RT9709 datasheet(4/12 Pages) RICHTEK

4 / 12 page

RT9709

DS9709-02 April 2011

www.richtek.com

Note 1. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.

These are stress ratings only, and functional operation of the device at these or any other conditions beyond those

indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

Note 2.

θJA is measured in the natural convection at TA = 25°C on a high effective four layers thermal conductivity test board of

JEDEC 51-7 thermal measurement standard. The case position of

θJC is on the exposed pad of the packages.

Note 3. Devices are ESD sensitive. Handling precaution is recommended.

Note 4. The device is not guaranteed to function outside its operating conditions.

Parameter

Symbol

Test Conditions

Min

Typ

Max

Units

Threshold

4.3

4.35

4.4

Battery Over Voltage Protection

VBOVP

Hysteresis

Battery OVP Blanking time

BTOVP

180

VB Pin Leakage Current

VVB = 4.4V

100

Rising

140

°C

OTP Threshold

TSD

Falling

°C

Logic

Logic-High Voltage

VIH

1.5

EN/ Threshold

Logic-Low Voltage

VIL

0.4

EN/ Internal Pull Down Resistor

100

200

400

WRN/ Output Logic Low

Sink 5mA

0.35

0.8

WRN Output Logic High Leakage

Current

Power MOSFET

On Resistance (P-MOSFET)

RON1

IOUT = 500mA, 4.3V < VIN < 6.5V

200

400

RT9709 Datasheet(PDF) 4 Page - Richtek Technology Corporation

RT9709 Datasheet(HTML) 4 Page - Richtek Technology Corporation

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12

Datasheet Download

Link URL