H960 datasheet(5/5 Pages) HSMC

5 / 5 page

HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : IC200916

Issued Date : 2009.09.12

Revised Date :

Page No. : 5/5

H960

HSMC Product Specification

DIP- 8 package dimension

α1

DIM

Min.

Max.

Marking:

Date Code

Control Code

Pb Free Mark

Pb-Free: "

. "(Note)

Normal: None

96 0

Pin Style: 1.OB 2.CT 3.GND 4.FB

5.VCC 6.OE 7.OC

8.OC

Material:

• Lead solder plating: Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0

6.29

6.40

9.22

9.32

*1.52

*1.27

*0.99

3.25

3.35

3.17

3.55

0.38

0.53

2.28

2.79

7.49

7.74

*3.00

8.56

8.81

0.229

0.381

α1

*: Typical, Unit: mm

8-Lead DIP-8

Plastic Package

HSMC Package Code: P

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to make changes to its products without notice.

• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office

• Head Office (Hi-Sincerity Microelectronics Corp.): 5/F., Golden Harvest Building 15 Wang Chiu Road, Kowloon Bay, Hong Kong

Tel: +852-2755-7162 Fax: +852-2755- 7795

AVANTICS : Shanghai Address: No.399, Cai Lum Rd. Zhangjiang Technology Industrial Park Pudong, Shanghai 201210, China

Tel: +86(21) 61637118

Fax: +86(21)61637006

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