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PCAL9539APW Datasheet(PDF) 43 Page - NXP Semiconductors |
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PCAL9539APW Datasheet(HTML) 43 Page - NXP Semiconductors |
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43 / 48 page ![]() PCAL9539A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 1 — 3 October 2012 43 of 48 NXP Semiconductors PCAL9539A 16-bit I2C-bus and SMBus low power I/O port with interrupt and reset 18. Soldering: PCB footprints Fig 36. PCB footprint for SOT355-1 (TSSOP24); reflow soldering DIMENSIONS in mm Ay By D1 D2 Gy Hy P1 C Gx sot355-1_fr Hx SOT355-1 solder land occupied area Footprint information for reflow soldering of TSSOP24 package Ay By Gy C Hy Hx Gx P1 Generic footprint pattern Refer to the package outline drawing for actual layout P2 (0.125) (0.125) D1 D2 (4x) P2 7.200 4.500 1.350 0.400 0.600 8.200 5.300 7.450 8.600 0.650 0.750 |
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