AD8023

Model

AD8023A

Conditions

Min

Typ

Max

Units

POWER SUPPLY (Continued)

Power Supply Rejection Ratio

±2.5 V to ±7.5 V

dB

Input Offset Voltage

54

76

dB

–Input Current

0.03

µA/V

+Input Current

0.07

µA/V

DISABLE CHARACTERISTICS

Off Isolation

f = 6 MHz

–70

dB

Off Output Capacitance

G = +1

12

pF

Turn-On Time

50

ns

Turn-Off Time

Ω

30

ns

Switching Threshold

1.6

V

Specifications subject to change without notice.

–3–

REV. A

ABSOLUTE MAXIMUM RATINGS

*

Supply Voltage

. . . . . . . . . . . . . . . . . . . . . . . . . . 15.5 V Total

Internal Power Dissipation

Small Outline (R) . . . . 1.0 Watts (Observe Derating Curves)

Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . .

±V

S

Differential Input Voltage . . . . . . . . . . . . . . . .

±3 V (Clamped)

Output Voltage Limit

Output Short Circuit Duration

. . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves

Storage Temperature Range

R Package . . . . . . . . . . . . . . . . . . . . . . . . –65

°C to +125°C

Operating Temperature Range

AD8023A . . . . . . . . . . . . . . . . . . . . . . . . . . –40

°C to +85°C

Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300

°C

*Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

ORDERING GUIDE

Temperature

Package

Package

Model

Range

Description

Option

AD8023AR

–40

°C to +85°C 14-Lead Plastic SOIC R-14

AD8023AR-

–40

°C to +85°C 13" Tape and Reel

R-14

REEL

AD8023AR-

–40

°C to +85°C 7" Tape and Reel

R-14

REEL7

AD8023ACHIPS –40

°C to +85°CDie

Maximum Power Dissipation

The maximum power that can be safely dissipated by the AD8023

is limited by the associated rise in junction temperature. The

maximum safe junction temperature for the plastic encapsulated

parts is determined by the glass transition temperature of the

plastic, about 150

°C. Temporarily exceeding this limit may

cause a shift in parametric performance due to a change in the

stresses exerted on the die by the package. Exceeding a junction

temperature of 175

°C for an extended period can result in

device failure.

While the AD8023 is internally short circuit protected, this may

not be enough to guarantee that the maximum junction temper-

ature is not exceeded under all conditions. To ensure proper

operation, it is important to observe the derating curves.

It must also be noted that in (noninverting) gain configurations

(with low values of gain resistor), a high level of input overdrive

can result in a large input error current, which may result in a

significant power dissipation in the input stage. This power

must be included when computing the junction temperature rise

due to total internal power.

AMBIENT TEMPERATURE – C

2.5

2.0

0.5

–50

90

–40 –30 –20

0

1020

30

4050

6070

80

1.5

1.0

–10

14-LEAD SOIC

Figure 3. Maximum Power Dissipation vs. Ambient

Temperature

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although

the AD8023 features proprietary ESD protection circuitry, permanent damage may occur on devices

subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recom-

mended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE