REV. A

–4–

ADG417

ABSOLUTE MAXIMUM RATINGS

1

°C unless otherwise noted)

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +44 V

Analog, Digital Inputs

2

or 30 mA, Whichever Occurs First

Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA

Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA

(Pulsed at 1 ms, 10% Duty Cycle Max)

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . . . –40

°C to +85°C

Extended (T Version) . . . . . . . . . . . . . . . . –55

°C to +125°C

Storage Temperature Range . . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150

°C

Plastic Package, Power Dissipation . . . . . . . . . . . . . . . 400 mW

θ

. . . . . . . . . . . . . . . . . . . . 100

°C/W

Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260

°C

SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 400 mW

θ

. . . . . . . . . . . . . . . . . . . . 155

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec). . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

NOTES

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability. Only one absolute

maximum rating may be applied at any one time.

limited to the maximum ratings given.

Analog voltage on terminals D, S.

“OFF” switch source capacitance.

“OFF” switch drain capacitance.

“ON” switch capacitance.

Delay between applying the digital control

input and the output switching on.

Delay between applying the digital control

input and the output switching off.

Maximum input voltage for logic “0.”

Minimum input voltage for logic “1.”

Input current of the digital input.

Charge Injection

A measure of the glitch impulse transferred

from the digital input to the analog output

during switching.

Off Isolation

A measure of unwanted signal coupling

through an “OFF” channel.

Positive supply current.

Negative supply current.

Logic supply current.

TERMINOLOGY

Most positive power supply potential.

Most negative power supply potential in dual

supplies. In single supply applications, it

may be connected to GND.

Logic power supply (+5 V).

GND

Ground (0 V) reference.

S

Source terminal. May be an input or an

output.

D

Drain terminal. May be an input or an

output.

IN

Logic control input.

Ohmic resistance between D and S.

Source leakage current with the switch

“OFF.”

Drain leakage current with the switch

“OFF.”

Channel leakage current with the switch

“ON.”

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the ADG417 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE