ADG441/ADG442/ADG444

REV. 0

–4–

ABSOLUTE MAXIMUM RATINGS

1

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+44 V

Analog, Digital Inputs

2

or 30 mA, Whichever Occurs First

Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA

Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA

(Pulsed at 1 ms, 10% Duty Cycle Max)

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . . . . –40

°C to +85°C

Extended (T Version) . . . . . . . . . . . . . . . . –55

°C to +125°C

Storage Temperature Range . . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150

°C

Cerdip Package, Power Dissipation . . . . . . . . . . . . . . . 900 mW

θ

. . . . . . . . . . . . . . . . . . . . . . . 76

°C/W

Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . +300

°C

Plastic Package, Power Dissipation . . . . . . . . . . . . . . . 470 mW

θ

. . . . . . . . . . . . . . . . . . . . . . 177

°C/W

Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . +260

°C

SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 600 mW

θ

. . . . . . . . . . . . . . . . . . . . . . . 77

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

NOTES

permanent damage to the device. This is a stress rating only and functional

operation of the device at these or any other conditions above those listed in the

operational sections of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability. Only

one absolute maximum rating may be applied at any one time.

limited to the maximum ratings given.

ADG441/ADG442 PIN CONFIGURATION (DIP/SOIC)

NC = NO CONNECT

IN1

D1

IN2

D2

GND

S4

D4

NC

S3

D3

S1

S2

IN4

IN3

1

2

16

15

5

6

7

12

11

10

3

4

14

13

89

TOP VIEW

(Not to Scale)

ADG441

ADG442

ADG444 PIN CONFIGURATION (DIP/SOIC)

TERMINOLOGY

Most Positive Power Supply Potential.

Most Negative Power Supply Potential in dual

supplies. In single supply applications, it may be

connected to ground.

Logic Power Supply (+5 V).

GND

Ground (0 V) Reference.

S

Source Terminal. May be an input or output.

D

Drain Terminal. May be an input or output.

IN

Logic Control Input.

Ohmic resistance between D and S.

Source leakage current with the switch “OFF.”

Drain leakage current with the switch “OFF.”

Channel leakage current with the switch “ON.”

Analog voltage on terminals D, S.

“OFF” Switch Source Capacitance.

“OFF” Switch Drain Capacitance.

“ON” Switch Capacitance.

Delay between applying the digital control

input and the output switching on.

Delay between applying the digital control

input and the output switching off.

Break-Before-Make Delay when switches are

configured as a multiplexer.

Crosstalk

A measure of unwanted signal which is coupled

through from one channel to another as a result

of parasitic capacitance.

Off Isolation

A measure of unwanted signal coupling through

an “OFF” switch.

Charge

A measure of the glitch impulse transferred from

Injection

the digital input to the analog output during

switching.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although these devices feature proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

IN1

D1

IN2

D2

GND

S4

D4

V

L

S3

D3

S1

V

SS

S2

V

DD

IN4

IN3

1

2

16

15

5

6

7

12

11

10

3

4

14

13

89

TOP VIEW

(Not to Scale)

ADG444