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TPS61196PWPR Datasheet(PDF) 2 Page - Texas Instruments |
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TPS61196PWPR Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 30 page ![]() TPS61196 SLVSBG1C – OCTOBER 2012 – REVISED FEBRUARY 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION(1) TA PACKAGE ORDERING PART NUMBER TOP MARK -40°C to 85°C 28-Pin HTSSOP TPS61196PWPR TPS61196 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VALUE UNIT MIN MAX Pin VIN –0.3 33 Pin FAULT –0.3 VIN Pin IFB1 to IFB6 –0.3 40 Pin FBP, ISET, ISNS, IFBV –0.3 3.3 Voltage range(2) V Pin EN, PWM1 to PWM6 –0.3 20 Pin GDRV –0.3 7.0 Pin GDRV 10ns transient –2.0 9.0 All other pins –0.3 7.0 HBM 2 kV ESD rating MM 200 V CDM 1 kV Continuous power dissipation See Thermal Information Table Operating junction temperature range –40 150 °C Storage temperature range –65 150 °C (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal THERMAL INFORMATION TPS61196 THERMAL METRIC(1) UNITS PWP (28 PINS) θJA Junction-to-ambient thermal resistance 33.8 θJCtop Junction-to-case (top) thermal resistance 18.8 θJB Junction-to-board thermal resistance 15.6 °C/W ψJT Junction-to-top characterization parameter 0.6 ψJB Junction-to-board characterization parameter 15.4 θJCbot Junction-to-case (bottom) thermal resistance 2.5 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links :TPS61196 |
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