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OR3LP26B Datasheet(PDF) 179 Page - Agere Systems |
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OR3LP26B Datasheet(HTML) 179 Page - Agere Systems |
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179 / 184 page  Lucent Technologies Inc. 179 Data Sheet ORCA OR3LP26B FPSC March 2000 Embedded Master/Target PCI Interface Lucent Technologies Inc. Package Thermal Characteristics Summary (continued) Table 71 . ORCA OR3LP26B Plastic Package Thermal Guidelines * Mounted on a four-layer JEDEC standard test board with two power/ground planes. † With thermal balls connected to board ground plane. ‡ The value of ψJC for all packages is <1 °C/W. Package Coplanarity The coplanarity limits of the ORCA Series 3 packages are as follows. Table 72. Package Coplanarity Package* ΘJA (°C/W) TA = 70 °C Max TJ = 125 °C Max 0 fpm (W) 0 fpm 200 fpm 500 fpm 352-Pin PBGA† ‡ 19.0 16.0 15.0 2.9 680-Pin PBGAM† ‡ 14.5 TBD TBD 3.8 Package Type Coplanarity Limit (mils) PBGA 8.0 PBGAM 8.0 |
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