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OR3LP26B Datasheet(PDF) 180 Page - Agere Systems |
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OR3LP26B Datasheet(HTML) 180 Page - Agere Systems |
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180 / 184 page ![]() ORCA OR3LP26B FPSC Data Sheet Embedded Master/Target PCI Interface March 2000 180 Lucent Technologies Inc. Lucent Technologies Inc. Package Parasitics The electrical performance of an IC package, such as signal quality and noise sensitivity, is directly affected by the package parasitics. Table 73 lists eight parasitics associated with the ORCA packages. These parasitics represent the contributions of all components of a package, which include the bond wires, all internal package routing, and the external leads. Four inductances in nH are listed: LSW and LSL, the self-inductance of the lead; and LMW and LML, the mutual inductance to the nearest neighbor lead. These parameters are important in determining ground bounce noise and inductive crosstalk noise. Three capacitances in pF are listed: CM, the mutual capacitance of the lead to the near- est neighbor lead; and C1 and C2, the total capacitance of the lead to all other leads (all other leads are assumed to be grounded). These parameters are important in determining capacitive crosstalk and the capacitive loading effect of the lead. The lead resistance value, RW, is in m Ω. The parasitic values in Table 73 are for the circuit model of bond wire and package lead parasitics. If the mutual capacitance value is not used in the designer’s model, then the value listed as mutual capacitance should be added to each of the C1 and C2 capacitors. Table 73. Package Parasitics 5-3862(F).a Figure 66. Package Parasitics Package Type LSW (nH) LMW (nH) RW (m Ω) C1 (pF) C2 (pF) CM (pF) LSL (nH) LML (nH) 352-Pin PBGA 5 2 220 1.5 1.5 1.5 7—12 3—6 680-Pin EBGA 3.8 1.3 250 1.0 1.0 0.3 2.8—5.0 0.5—1.0 PAD N BOARD PAD CM C1 LSW RW LSL LMW C2 C1 LML C2 PAD N + 1 LSW RW LSL |
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