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AL8808 Datasheet(PDF) 3 Page - Diodes Incorporated |
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AL8808 Datasheet(HTML) 3 Page - Diodes Incorporated |
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3 / 20 page ![]() AL8808 Document number: DS35648 Rev. 2 - 2 3 of 20 www.diodes.com January 2013 © Diodes Incorporated AL8808 Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.) Symbol Parameter Min Max Unit VIN Operating Input Voltage Relative to GND 6.0 30 V VCTRLH Voltage High for PWM Dimming Relative to GND 2.6 5.5 V VCTRLDC Voltage Range for 20% to 100% DC Dimming Relative to GND 0.5 2.5 V VCTRLL Voltage Low for PWM Dimming Relative to GND 0 0.4 V ISW Continuous Switch Current (Note 4) 1 A fSW Maximum Switching Frequency 1 MHz TJ Junction Temperature Range -40 +125 °C Note: 4. Subject to ambient temperature, input voltage and switching frequency. See applications section for suggested derating. Electrical Characteristics (@ TA = +25°C, VIN = 12V, CTRL pin floating; unless otherwise specified.) Symbol Parameter Conditions Min Typ Max Unit VINSU Internal Regulator Start Up Voltage VIN rising 5.6 V VINSH Internal Regulator Hysteresis Threshold VIN falling 200 mV IQ Quiescent Current VIN = 30V, output not switching 350 µA IS Input Supply Current fSW = 250kHz 450 µA VTH Set Current Threshold Voltage 95 100 105 mV VTH-H Set Threshold Hysteresis ±20 mV ISET SET Pin Input Current VSET = VIN -0.1 16 µA VCTRL Open Circuit CTRL Pin Voltage 5 V RCTRL CTRL Pin Input Resistance Referred to internal 5V regulator. 50 kΩ VREF Internal Reference Voltage 2.5 V RDS(on) On Resistance of SW MOSFET ISW = 0.35A 0.35 Ω ISW_Lkg Switch Leakage Current VIN = 30V, VCTRL = 0.4V, VSENSE = 0V 0.5 µA tR SW Rise Time VSENSE = 100 ±20mV, fSW = 250kHz VSW = 0.1V to 12V to 0.1V, CL = 15pF 7 ns tF SW Fall Time 5 ns TOTP Over-Temperature Shutdown 145 °C TOTP-Hyst Over-Temperature Hysteresis 10 °C θJA Thermal Resistance Junction-to-Ambient TSOT25 (Note 5) 209 °C/W θJL Thermal Resistance Junction-to-Lead TSOT25 (Note 5) 57 θJT Thermal Resistance Junction-to-Top TSOT25 (Note 5) 13 Notes: 5. Device mounted on FR-4 PCB (25mm x 25mm 1oz copper, minimum recommended pad layout on top layer and thermal vias to maximum area bottom layer ground plane. For better thermal performance, larger copper pad for heat-sink is needed. …Refer to Figure 42 for the device derating curve. |
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