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AL8808 Datasheet(PDF) 3 Page - Diodes Incorporated

Part # AL8808
Description  COST EFFECTIVE LOW EMI 30V 1A BUCK LED DRIVER
PDF  20 Pages
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

AL8808 Datasheet(HTML) 3 Page - Diodes Incorporated

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AL8808
Document number: DS35648 Rev. 2 - 2
3 of 20
www.diodes.com
January 2013
© Diodes Incorporated
AL8808
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)
Symbol
Parameter
Min
Max
Unit
VIN
Operating Input Voltage Relative to GND
6.0
30
V
VCTRLH
Voltage High for PWM Dimming Relative to GND
2.6
5.5
V
VCTRLDC
Voltage Range for 20% to 100% DC Dimming Relative to GND
0.5
2.5
V
VCTRLL
Voltage Low for PWM Dimming Relative to GND
0
0.4
V
ISW
Continuous Switch Current (Note 4)
1
A
fSW
Maximum Switching Frequency
1
MHz
TJ
Junction Temperature Range
-40
+125
°C
Note:
4. Subject to ambient temperature, input voltage and switching frequency. See applications section for suggested derating.
Electrical Characteristics (@ TA = +25°C, VIN = 12V, CTRL pin floating; unless otherwise specified.)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VINSU
Internal Regulator Start Up Voltage
VIN rising
5.6
V
VINSH
Internal Regulator Hysteresis Threshold
VIN falling
200
mV
IQ
Quiescent Current
VIN = 30V, output not switching
350
µA
IS
Input Supply Current
fSW = 250kHz
450
µA
VTH
Set Current Threshold Voltage
95
100
105
mV
VTH-H
Set Threshold Hysteresis
±20
mV
ISET
SET Pin Input Current
VSET = VIN -0.1
16
µA
VCTRL
Open Circuit CTRL Pin Voltage
5
V
RCTRL
CTRL Pin Input Resistance
Referred to internal 5V regulator.
50
kΩ
VREF
Internal Reference Voltage
2.5
V
RDS(on)
On Resistance of SW MOSFET
ISW = 0.35A
0.35
Ω
ISW_Lkg
Switch Leakage Current
VIN = 30V, VCTRL = 0.4V, VSENSE = 0V
0.5
µA
tR
SW Rise Time
VSENSE = 100 ±20mV, fSW = 250kHz
VSW = 0.1V to 12V to 0.1V, CL = 15pF
7
ns
tF
SW Fall Time
5
ns
TOTP
Over-Temperature Shutdown
145
°C
TOTP-Hyst Over-Temperature Hysteresis
10
°C
θJA
Thermal Resistance Junction-to-Ambient
TSOT25 (Note 5)
209
°C/W
θJL
Thermal Resistance Junction-to-Lead
TSOT25 (Note 5)
57
θJT
Thermal Resistance Junction-to-Top
TSOT25 (Note 5)
13
Notes:
5. Device mounted on FR-4 PCB (25mm x 25mm 1oz copper, minimum recommended pad layout on top layer and thermal vias to maximum area
bottom layer ground plane. For better thermal performance, larger copper pad for heat-sink is needed.
…Refer to Figure 42 for the device derating curve.



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