ADMP510

Data Sheet

Rev. 0 | Page 8 of 12

PCB DESIGN AND LAND PATTERN LAYOUT

Lay out the PCB land pattern for the ADMP510 at a 1:1 ratio to

the solder pads on the microphone package (see Figure 13). Take

care to avoid applying solder paste to the sound hole in the PCB.

Figure 14 shows a suggested solder paste stencil pattern layout.

The diameter of the sound hole in the PCB should be larger than

the diameter of the sound port of the microphone. A minimum

diameter of 0.5 mm is recommended.

Ø1.55

Ø0.95

1.52

0.90

1.90

1.22

0.68

0.61

0.61

Figure 13. Suggested PCB Land Pattern Layout

1.22

2×

0.8 × 0.6

0.2 × 45°

TYP

1.52mm

1.55/1.05 DIA.

0.225 CUT WIDTH (2×)

Figure 14. Suggested Solder Paste Stencil Pattern Layout