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LM7301 Datasheet(PDF) 5 Page - Texas Instruments |
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LM7301 Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 22 page  LM7301 www.ti.com SNOS879H – AUGUST 1999 – REVISED MARCH 2013 2.2V DC Electrical Characteristics (1) (continued) Unless otherwise specified, all limits guaranteed for TA = 25°C, V + = 2.2V, V− = 0V, V CM = VO = V +/2 and R L > 1MΩ to V +/2. Boldface limits apply at the temperature extremes. LM7301 Symbol Parameter Conditions Units Typ Limit (2) (3) ISC Output Short Circuit Current Sourcing 10.9 8.0 mA 5.5 min Sinking 7.7 6.0 mA 5.0 min IS Supply Current 0.57 0.97 mA 1.24 max 30V DC Electrical Characteristics (1) Unless otherwise specified, all limits guaranteed for TA = 25°C, V + = 30V, V− = 0V, V CM = VO = V +/2 and R L > 1MΩ to V +/2. Boldface limits apply at the temperature extremes. LM7301 Symbol Parameter Conditions Units Typ Limit (2) (3) 0.04 6 mV VOS Input Offset Voltage 8 max TCVOS Input Offset Voltage Average Drift 2 μV/°C IB Input Bias Current VCM = 0V 103 300 nA 500 max VCM = 30V −50 −100 nA −200 min IOS Input Offset Current VCM = 0V 1.2 90 nA 190 max VCM = 30V 0.5 65 nA 135 max RIN Input Resistance 0V ≤ VCM ≤ 30V 200 M Ω CMRR Common Mode Rejection Ratio 0V ≤ VCM ≤ 30V 104 80 dB 78 min 0V ≤ VCM ≤ 27V 115 90 88 PSRR Power Supply Rejection Ratio 2.2V ≤ V+ ≤ 30V 104 87 84 VCM Input Common-Mode Voltage Range CMRR > 80 dB 30.1 V −0.1 V AV Large Signal Voltage Gain RL = 10 kΩ 105 30 V/mV VO = 28VPP 20 min VO Output Swing RL = 10 kΩ 0.16 0.275 V max 0.375 29.8 29.75 V min 28.65 ISC Output Short Circuit Current Sourcing(4) 11.7 8.8 mA 6.5 min Sinking(4) 11.5 8.2 mA 6.0 min (1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the devices such that TJ = TA. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. (2) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not guaranteed on shipped production material. (3) All limits are guaranteed by testing or statistical analysis. (4) The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) − TA)/θJA. All numbers apply for packages soldered directly into a PC board. Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM7301 |
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