BAT46WH

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© NXP B.V. 2011. All rights reserved.

Product data sheet

Rev. 2 — 28 November 2011

2 of 12

NXP Semiconductors

BAT46WH

Single Schottky barrier diode

3.

Ordering information

4.

Marking

5.

Limiting values

[1]

[2]

Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

[3]

[4]

Reflow soldering is the only recommended soldering method.

6.

Thermal characteristics

Table 3.

Ordering information

Type number

Package

Name

Description

Version

BAT46WH

-

plastic surface-mounted package; 2 leads

SOD123F

Table 4.

Marking codes

Type number

Marking code

BAT46WH

DB

Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

reverse voltage

-

100

V

forward current

-

250

mA

non-repetitive peak

forward current

square wave;

[1] -2.5

A

total power dissipation

[2][4] -440

mW

[3][4] -780

mW

junction temperature

-

150

C

ambient temperature

55

+150

C

storage temperature

65

+150

C

Table 6.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance from

junction to ambient

in free air

[1][3] -

-

285

K/W

[2][3] -

-

160

K/W