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ACCTB13E 201303-T

Notes on Using FPC Connectors

■ PC board design

Design the recommended foot pattern in order to secure the

mechanical strength in the soldered areas of the terminal.

■ FPC and equipment design

• Design the FPC based with recommended dimensions to

ensure the required connector performance.

• When using back lock type, secure enough space for closing

the lever and for open-close operation of the lever.

• Make sure that connector positioning and FPC length are

appropriate to prevent diagonal insertion of the FPC.

Due to the FPC size, weight, or the reaction force of the routed

FPC, FPC may be removed. Carefully check the equipment

design.

Take required measures to prevent the FPC from being removed

due to a fall, vibration, or other impact.

(Y3BW/Y5BW)

■ The holding contacts cannot be used as conductors.

The holding contacts are located on both ends of the contacts,

and the shape of the soldered portions is the same as that of the

other contacts.

Use caution to ensure connect identification.

(Y3BL)

■ Soldering terminal structure

Since soldering terminals touch FPC, note that the short circuit

may occur when the metal parts exposed on side of FPC.

■ Connector mounting

Excessive mounter chucking force may deform the molded or

metal part of the connector. Consult us in advance if chucking is

to be applied.

■ Soldering

1) Manual soldering

• Due to the connector’s compact size, if an excessive amount of

solder is applied during manual soldering, the solder may creep

up and flux wicking near the contact points, or solder

interference may cause contact failure.

• Make sure that the soldering iron tip is heated within the

temperature and time limits indicated in the specifications.

• Flux from the solder wire may adhere to the contact surfaces

during soldering operations. After soldering, carefully check the

contact surfaces and cleans off any flux solder use.

• Be aware that a load applied to the connector terminals while

soldering may displace the contact.

• Thoroughly clean the iron tip.

2) Reflow soldering

• Screen-printing is recommended for printing paste solder.

• To achieve the appropriate soldering state, make sure that the

reflow temperature, PC board foot pattern, window size and

thickness of metal mask are recommended condition.

• Note that excess solder on the terminals prevents complete

insertion of the FPC, and causes flux climbing up.

• A screen thickness of 120

µm is recommended during cream

solder printing.

• Consult us when using a screen-printing thickness other than

that recommended.

• Depending on the size of the connector being used, self

alignment may not be possible. Accordingly, carefully position

the terminal with the PC board pattern.

• The recommended reflow temperature profile is given in the

figure below.

• The temperature is measured on the surface of the PC board

near the connector terminals.

• Depending on reflow condition, poor contact may occur by

solder and flux wicking.

Please set the reflow conditions that considering the

characteristics of solder and flux. Also please make

prevent poor contact by solder and flux wicking.

• When performing reflow soldering on the back of the PC board

after reflow soldering the connector, secure the connector using,

for example, an adhesive.

(Double reflow soldering on the same side is possible.)

Do not touch the lever or apply any load to the lever until the

second reflow soldering. Otherwise, contact deflection occurs

and the terminals may be deformed by reflow heating.

3) Reworking on a soldered portion

• Finish reworking in one operation.

• For reworking of the solder bridge, use a soldering iron with a

flat tip.

Do not add flux, otherwise the flux may creep to the contact

parts.

When adding the solder for reworking, do not add an excessive

solder. Otherwise, solder and flux may creep up and solder

bridges may occur.

• Use a soldering iron whose tip temperature is within the

temperature range specified in the specifications.

■ Do not drop or handle the connector carelessly.

Otherwise, the terminals may become deformed due to

excessive force or applied solderability may be during

reflow degrade.

■ Do not open/close the lever or insert/remove an FPC until

the connector is soldered. Forcibly applied external

pressure on the terminals can weaken the adherence of the

terminals to the molded part or cause the terminals to lose

their evenness. In addition, do not insert an FPC into the

connector before soldering the connector.

■ When cutting or bending the PC board after mounting the

connector, be careful that the soldered sections are

subjected to excessive force.

150

°C

180

°C

230

°C

220

°C

200

°C

260

°C

Temperature

Upper limit (Soldering heat resistance)

Lower limit (Solder wettability)

Preheating

Peak temperature

Time

25 sec.

70 sec.

60 to 120 sec.

The soldered areas should not be subjected to force.