ADP2109

Data Sheet

Rev. B | Page 4 of 16

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

VIN, EN

−0.4 V to +6.5 V

FB, SW to GND

Operating Ambient Temperature Range

−40°C to +85°C

Operating Junction Temperature Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature Range

−65°C to +150°C

Soldering Conditions

JEDEC J-STD-020

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Absolute maximum ratings apply individually only, not in

combination. Unless otherwise specified, all other voltages are

referenced to GND.

The ADP2109 can be damaged when the junction temperature

limits are exceeded. Monitoring ambient temperature does not

temperature limits. In applications with high power dissipation

and poor thermal resistance, the maximum ambient tempera-

ture may have to be derated. In applications with moderate

power dissipation and low PCB thermal resistance, the max-

imum ambient temperature can exceed the maximum limit

the power dissipation (PD) of the device, and the junction-to-

THERMAL RESISTANCE

Table 4. Thermal Resistance

Package Type

Unit

5-Ball WLCSP

105

°C/W

ESD CAUTION