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AP2152 Datasheet(PDF) 14 Page - Asahi Kasei Microsystems |
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AP2152 Datasheet(HTML) 14 Page - Asahi Kasei Microsystems |
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14 / 18 page ![]() [AP2152] MS1348-E-00 14 2012/05 3) Protection Function Protection Description Detection time Shut-off state Detection condition Release condition PGOOD Thermal When the IC temperature rises and reaches the detection condition and exceeds the detection time, the DC/DC boost converter and the LED constant current circuit are latched off. TTM *2 Latch off 125℃min *1 ON Over current Internal Nch power MOSFET drain current is monitored by using an internal detection resistor. If exceeding the detection condition, the power MOSFET is turned off. And if exceeding the detection time, the DC/DC boost converter and the LED constant current circuit are latched off. TTM *2 Latch off 2.6A *1 ON Over voltage (OVP) If the OVP pin voltage reaches the detection condition, the DC/DC boost converter is immediately shut off. In this case, the LED constant current circuit is still operating LED anode voltage control Auto-release More than 1.2V 1.2V or less OFF OVP pin short If the OVP pin reaches the detection condition caused by the OVP pin shorted to GND, the LED anode shorted to GND or the Schottky diode open, the DC/DC boost converter and the LED constant current circuit are immediately shut off and the internal PGOOD FET is turned on. If the OVP pin voltage reaches the release condition, normal operation is resumed. If exceeding the detection time, the DC/DC boost converter and the LED constant current circuit are latched off. Cease all Auto-release ↓ TTM *2 Latch off Lass than 0.1V More than 0.1V ↓ *1 ON UVLO To prevent malfunction of the IC when the VIN voltage reaches the detection condition. Circuits excluding the UVLO circuit stop the operation. If the VIN voltage returns to the release condition, the IC resumes normal operation. Cease all Auto-release 3.75Vmin 4.45Vmax ON LDO short To prevent malfunction and over heating of the IC when the VDC pin shorts to GND. The LDO current is limited to low levels. If the short state goes away, the IC resumes normal operation. Cease all Auto-release More than 30mA 30mA or less OFF CH short When the CH pin shorts to GND, the voltage reaches the detection condition, and exceeds the detection time, the DC/DC boost converter and the LED constant current are ceased. TTM *2 Latch off 0.1V *1 ON LED open If the CH pin is opened due to an LED disconnection or destruction as an open state, the CH pin is latched off. Internal timer each CH Latch off Less than LED set current when OVP Voltage *1 OFF *3 LED short If the CH pin voltage reaches the detection condition due to destruction by an LED short, the CH pin is latched off. Internal timer each CH Latch off 12V *1 OFF *4 ISET short To prevent heat generation due to increases in the LED current when the ISET pin shorts to GND, the Nch power MOSFET operation is ceased. If the short state goes away, the IC resumes the normal operation. Cease Nch Power MOSFET Auto-release ISET pin GND short ISET pin normal 1V OFF RT short To prevent heat generation due to increases in the switching frequency when the RT pin shorts to GND, the Nch power MOSFET operation is ceased. If the short state goes away, the IC resumes the normal operation. Cease Nch Power MOSFET Auto-release RT pin GND short RT pin Normal 1V OFF Note: *1. In order to release the latch off state, the PWM pin should be maintained at a low level for 50ms or longer or the supply voltage should be pulled down less than the UVLO voltage. *2. Set time by external capacitor on the TM pin. Refer to the timer latch setting. *3. OFF when 1 CH or 2 CHs out of 3 CHs is/are open state, ON when all 3 CHs are open state. *4. OFF when 1 CH or 2 CHs out of 3 CHs is/are short state, ON when all 3 CHs are short state. |
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