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PMC85XP Datasheet(PDF) 3 Page - NXP Semiconductors

Part # PMC85XP
Description  30 V P-channel MOSFET with pre-biased NPN transistor
PDF  15 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

PMC85XP Datasheet(HTML) 3 Page - NXP Semiconductors

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NXP Semiconductors
PMC85XP
30 V P-channel MOSFET with pre-biased NPN transistor
PMC85XP
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved
Product data sheet
15 May 2013
3 / 15
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
P-channel Trench MOSFET
VDS
drain-source voltage
-
-30
V
VGS
gate-source voltage
Tj = 25 °C
-12
12
V
VGS = -4.5 V; Tamb = 25 °C; t ≤ 5 s
[1]
-
-3.4
A
VGS = -4.5 V; Tamb = 25 °C
[1]
-
-2.6
A
ID
drain current
VGS = -4.5 V; Tamb = 100 °C
[1]
-
-1.6
A
IDM
peak drain current
Tamb = 25 °C; single pulse; tp ≤ 10 µs
-
-8
A
[2]
-
485
mW
Tamb = 25 °C
[1]
-
1170
mW
Ptot
total power dissipation
Tsp = 25 °C
[2]
-
8300
mW
P-channel Trench MOSFET; source-drain diode
IS
source current
Tamb = 25 °C
[1]
-
-1.2
A
NPN RET
VCBO
collector-base voltage
Tamb = 25 °C; open emitter
-
50
V
VCEO
collector-emitter voltage
Tamb = 25 °C; open base
-
50
V
VEBO
emitter-base voltage
Tamb = 25 °C; open collector
-
10
V
positive
-
30
V
VI
input voltage
negative
-
-5
V
IO
output current
-
100
mA
ICM
peak collector current
-
100
mA
[2]
-
465
mW
Tamb = 25 °C
[1]
-
985
mW
Ptot
total power dissipation
Tsp = 25 °C
[2]
-
4160
mW
Per device
Tj
junction temperature
-55
150
°C
Tamb
ambient temperature
-55
150
°C
Tstg
storage temperature
-65
150
°C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and mounting pad
for drain 6 cm2
[2] Device mounted on an FR4 PCB, single-sided copper; tin-plated and standard footprint.



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