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M24128-DF Datasheet(PDF) 24 Page - STMicroelectronics

Part # M24128-DF
Description  128-Kbit serial I²C bus EEPROM
PDF  40 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

M24128-DF Datasheet(HTML) 24 Page - STMicroelectronics

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DC and AC parameters
M24128-BW M24128-BR M24128-BF M24128-DF
24/40
DocID16892 Rev 23
Table 10. Input parameters
Symbol
Parameter(1)
1. Characterized only, not tested in production.
Test condition
Min.
Max.
Unit
CIN
Input capacitance (SDA)
-
-
8
pF
CIN
Input capacitance (other pins)
-
-
6
pF
ZL
Input impedance (E2, E1, E0, WC)(2)
2. E2, E1, E0 input impedance when the memory is selected (after a Start condition).
VIN < 0.3 VCC
50
-
k
Ω
ZH
VIN > 0.7 VCC
500
-
k
Ω
Table 11. Cycling performance by groups of four bytes
Symbol
Parameter
Test condition(1)
1. Cycling performance for products identified by process letter K.
Max.
Unit
Ncycle
Write cycle
endurance(2)
2. The Write cycle endurance is defined for groups of four data bytes located at addresses [4*N,
4*N+1, 4*N+2, 4*N+3] where N is an integer. The Write cycle endurance is defined by
characterization and qualification.
TA
≤ 25 °C, VCC(min) < VCC <
VCC(max)
4,000,000
Write cycle(3)
3. A Write cycle is executed when either a Page Write, a Byte Write, a Write Identification Page or
a Lock Identification Page instruction is decoded. When using the Byte Write, the Page Write or
the Write Identification Page, refer also to Section 5.1.5: ECC (Error Correction Code) and
Write cycling.
TA = 85 °C, VCC(min) < VCC < VCC(max) 1,200,000
Table 12. Memory cell data retention
Parameter
Test condition
Min.
Unit
Data retention(1)
1. For products identified by process letter K. The data retention behavior is checked in
production. The 200-year limit is defined from characterization and qualification results.
TA = 55 °C
200
Year
Table 13. DC characteristics (M24128-BW, device grade 6)
Symbol
Parameter
Test conditions (in addition to those
in Table 6)
Min.
Max.
Unit
ILI
Input leakage current
(SCL, SDA, E2, E1,
E0)
VIN = VSS or VCC, device in Standby
mode
-± 2
µA
ILO
Output leakage
current
SDA in Hi-Z, external voltage applied
on SDA: VSS or VCC
-± 2
µA
ICC
Supply current (Read)
VCC = 2.5 V, fc = 400 kHz
(rise/fall time < 50 ns)
-1(1)
mA
VCC = 5.5 V, fc = 400 kHz
(rise/fall time < 50 ns)
-2
mA
2.5 V < VCC < 5.5 V, fc = 1 MHz(2)
(rise/fall time < 50 ns)
-2.5
mA



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