Specifications

ZigBit™ 2.4 GHz Amplified Wireless Modules

3-14

8228B–MCU Wireless–06/09

3.4

Mounting Information

The below diagrams show the PCB layout recommended for ZigBit Amp module. Neither via-holes nor

wires are allowed on the PCB upper layer in area occupied by the module. As a critical requirement,

RF_GND pins should be grounded via several holes to be located right next to pins thus minimizing

inductance and preventing both mismatch and losses.

Figure 3-4.

ATZB-A24-UFL/U0 PCB Recommended Layout, Top View

3.5

Soldering Profile

The J-STD-020C-compliant soldering profile is recommended according to Table 3-7.

Note:

1. The package is backward compatible with PB/Sn soldering profile.

Table 3-7. Soldering profile

(1)

Profile Feature

Green package

Average ramp-up rate (217

°C to peak)

3

°C/s max

Preheat tempearture 175

°C ± 25°C

180s max

Temperature maintained above 217

°C

60s to 150s

Time within 5

°C of actual peak temperature

20s to 40s

Peak temperature range

260

°C

Ramp-down rate

6

°C/s max

Time within 25

°C to peak temperature

8 minuts max