TPS75003

SBVS052I – OCTOBER 2004 – REVISED AUGUST 2010

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PRODUCT

Buck1: Adjustable

TPS75003

Buck2: Adjustable

LDO: Adjustable

(1)

For the most current specifications and package information, see the Package Option Addendum located at the end of this document, or

see the TI website at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

Over operating free-air temperature range (unless otherwise noted)

(1)

TPS75003

UNIT

–0.3 to +7.0

V

V

V

V

–0.3 to +7.0

V

V

–0.3 to +3.3

V

Internally limited

—

Continuous total power dissipation

See Dissipation Ratings Table

—

–55 to +150

°C

Storage temperature range

–65 to +150

°C

ESD rating, HBM

1

kV

ESD rating, CDM

500

V

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under the Electrical Characteristics

is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.

THERMAL INFORMATION

TPS75003

UNITS

RHL (20 PINS)

Junction-to-ambient thermal resistance

42.6

Junction-to-case (top) thermal resistance

51.8

Junction-to-board thermal resistance

39.5

°C/W

Junction-to-top characterization parameter

0.6

Junction-to-board characterization parameter

14.2

Junction-to-case (bottom) thermal resistance

2.8

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.

2

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